Assembly Guide

This guide documents the build of a Chassis Size 2 inverter, chapter by chapter, in the order the physical assembly is performed. Chapters are published as each build phase is documented, so this index grows alongside the physical unit.

Read the preparation chapter first: it covers the workspace, equipment, and parts verification every chapter depends on.

Chapters

1. Preparation - workspace, equipment, and parts verification before starting.
2. DC-Link Filter Board - populating and soldering the DC-link filter PCB.
3. DC-Link Capacitor Board - populating and soldering the DC-link capacitor PCB.
4. IGBT Mounting - mounting the three IGBT half-bridge modules to the heatspreader, including thermal compound application and torque procedure.
5. IGBT Temperature Sensor Wiring Harness - building the temperature-sensor harnesses that connect to the control assembly.
6. IGBT Temperature Sensor Mounting - mounting the ring-lug temperature sensors to the heatspreader.
7. Bottom Stack Assembly - installing the bottom spacers, DC-link bus bars, filter board, and phase bus bars onto the heatspreader. The finished stack is then set aside.
8. DC-Link Capacitor Module Assembly - assembling the DC-link capacitor module from the populated capacitor board, bus bars, and film capacitors.
9. DC-Link Capacitor Module Mounting - mounting the DC-link capacitor module onto the bottom stack and making the bus-bar connections.
10. Control Assembly Mounting - mounting the assembled control module into the chassis.
11. Gate Drive and Voltage Sense Wiring Harness - building the harness connecting the control assembly to the gate driver board, carrying gate-drive and voltage-sense signals.
12. Current Sense Wiring Harness - building the harness connecting the phase current sensors to the control assembly.
13. Final Control Assembly - completing the control-side wiring and closing out the control assembly.
14. Review Checks - pre-power review: torque witness marks, polarity, insulation, and workmanship inspection.
15. Initial Low-Voltage Testing and Calibration - first low-voltage power-up, sensor checks, and calibration.
16. Outer Shell Mounting - mounting the outer shell onto the assembled power stage.

Note on chapter identifiers: each chapter's doc_id is assigned when the chapter is first authored and stays stable across later revisions, so doc_ids do not necessarily line up with chapter numbers (for example, Chapter 2 is OV-C2-AG-05-FILTER and Chapter 3 is OV-C2-AG-04-PCB). The chapter numbers above - the folder navigation order - are authoritative for build order; the doc_ids are stable identifiers for cross-referencing.

Planned build order

The physical build proceeds in roughly this order, and chapters follow it:

1. Preparation - workspace, ESD setup, equipment, and parts verification
2. DC-link filter board (PCB population)
3. DC-link capacitor board (PCB population)
4. IGBT mounting
5. IGBT temperature-sensor wiring harnesses
6. IGBT temperature-sensor mounting
7. Bottom stack assembly: spacers, bus bars, and filter board mounting; then set the stack aside
8. DC-link capacitor module assembly
9. DC-link capacitor module mounting
10. Control assembly mounting
11. Gate-drive and voltage-sense wiring harness
12. Current-sense wiring harness
13. Final control assembly
14. Review checks
15. Initial low-voltage testing and calibration
16. Outer shell mounting